Die Attach Machine Selection for Glue Voids Reduction Performance

The paper is focused on the glue voids reduction of quad-flat no-leads (QFN) devices evaluated on different die attach machine platforms. The evaluation was narrowed-down into two main die attach machines with the objective of attaining the best performance in terms of reducing or eliminating the glue voids. Glue voids were quantified and only die attach Machine B was able to satisfy the specification. The study used analysis of variance on the two machines and presented the effect of machine selection on glue voids reduction. For future works, the selected die attach machine could be used for devices with critical requirement.